Military Space News
CHIP TECH
Rice scientists pioneer transfer-free method to grow ultrathin semiconductors on electronics
illustration only
Rice scientists pioneer transfer-free method to grow ultrathin semiconductors on electronics
by Silvia Cernea Clark for Rice News
Houston TX (SPX) Aug 21, 2025
A team of materials scientists at Rice University has developed a new way to grow ultrathin semiconductors directly onto electronic components. The method, described in a study published in ACS Applied Electronic Materials, could help streamline the integration of two-dimensional materials into next-generation electronics, neuromorphic computing and other technologies demanding ultrathin high-speed semiconductors.

The researchers used chemical vapor deposition (CVD) to grow tungsten diselenide, a 2D semiconductor, directly onto patterned gold electrodes. They next demonstrated the approach by building a functional, proof-of-concept transistor. Unlike conventional techniques that require transferring fragile 2D films from one surface to another, the Rice team's method eliminates the transfer process entirely.

"This is the first demonstration of a transfer-free method to grow 2D devices," said Sathvik Ajay Iyengar, a doctoral student at Rice and a first author on the study along with Rice doctoral alumnus Lucas Sassi. "This is a solid step toward reducing processing temperatures and making a transfer-free, 2D semiconductor-integration process possible."

The discovery began with an unexpected observation during a routine experiment.

"We received a sample from a collaborator that had gold markers patterned on it," Sassi said. "During CVD growth, the 2D material unexpectedly formed predominantly on the gold surface. This surprising result sparked the idea that by deliberately patterning metal contacts, we might be able to guide the growth of 2D semiconductors directly across them."

Semiconductors are foundational to modern computing, and as the industry races toward smaller, faster and more efficient components, integrating higher-performance, atomically thin materials like tungsten diselenide is a growing priority.

Conventional device fabrication requires growing the 2D semiconductor separately, usually at very high temperatures, then transferring it using a series of steps. While 2D materials promise to outperform silicon in certain metrics, turning their lab-scale promise into industry-relevant applications has proven difficult - in large part due to the fragility of the materials during the transfer process.

"The transfer process can degrade the material and damage its performance," said Iyengar, who is part of Pulickel Ajayan's research group at Rice.

The Rice team optimized the precursor materials to lower the synthesis temperature of the 2D semiconductor and showed that it grows in a controlled, directional manner.

"Understanding how these 2D semiconductors interact with metals, especially when grown in situ, is really valuable for future device fabrication and scalability," said Ajayan, Rice's Benjamin M. and Mary Greenwood Anderson Professor of Engineering and professor of materials science and nanoengineering.

Using advanced imaging and chemical analysis tools, the team confirmed the method preserves the integrity of the metal contacts, which are vulnerable to damage at high temperatures.

"A lot of our work in this project was focused on proving that the materials system is still intact," Iyengar said. "We are well-equipped here at Rice to study the chemistry that goes on in this process to a very fine degree. Seeing what happens at the interface between these materials was a great motivator for the research."

The success of the method lies in the strong interaction between the metal and the 2D material during growth, Sassi noted.

"The absence of reliable, transfer-free methods for growing 2D semiconductors has been a major barrier to their integration into practical electronics," he said. "This work could unlock new opportunities for using atomically thin materials in next-generation transistors, solar cells and other electronic technologies."

In addition to challenges with the fabrication process, another key hurdle in 2D semiconductor design is electrical contacts' quality, which entails not just low energy barriers but also stable and enduring performance, scalability and compatibility with a wide range of materials.

"An in-situ growth approach allows us to combine several strategies for achieving improved contact quality simultaneously," said Anand Puthirath, a co-corresponding author of the study and a former research scientist at Rice.

The project was sparked by a question raised during a U.S.-India research initiative: Could a semiconductor fabrication process for 2D materials be developed on a limited budget?

"This started through our collaboration with partners in India," said Iyengar, who is a fellow of the Japan Society for the Promotion of Science and an inaugural recipient of the Quad Fellowship, a program launched by the governments of the U.S., India, Australia and Japan to support early career scientists in exploring how science, policy and diplomacy intersect on the global stage. "It showed how international partnerships can help identify practical constraints and inspire new approaches that work across global research environments."

Together with a couple of his peers in the Quad Fellowship cohort, Iyengar co-authored an article advocating for "the need for expertise at the intersection of STEM and diplomacy."

"Greater engagement between scientists and policymakers is critical to ensure that scientific advancements translate into actionable policies that benefit society as a whole," Iyengar said. "Materials science is one of the areas of research where international collaboration could prove invaluable, especially given constraints such as the limited supply of critical minerals and supply chain disruptions."

Research Report:Mechanistic Understanding and Demonstration of Direct Chemical Vapor Deposition of Transition Metal Dichalcogenides Across Metal Contacts

Related Links
Rice University
Computer Chip Architecture, Technology and Manufacture
Nano Technology News From SpaceMart.com

Subscribe Free To Our Daily Newsletters
Tweet

RELATED CONTENT
The following news reports may link to other Space Media Network websites.
CHIP TECH
Caltech scientists use sound to remember quantum information
Pasadena CA (SPX) Aug 15, 2025
While conventional computers store information in the form of bits, fundamental pieces of logic that take a value of either 0 or 1, quantum computers are based on qubits. These can have a state that is simultaneously both 0 and 1. This odd property, a quirk of quantum physics known as superposition, lies at the heart of quantum computing's promise to ultimately solve problems that are intractable for classical computers. Many existing quantum computers are based on superconducting electronic syste ... read more

CHIP TECH
Germany to start deliveries of two Patriot systems to Ukraine

Israel military intercepts Huthi missile fired from Yemen; Gaza civil defence says Israel strikes kill 30

Germany seeks US guarantee before sending Patriots to Ukraine

Israel says intercepted missile fired from Yemen

CHIP TECH
Zelensky says Ukraine has tested new long-range missile

Pakistan establishes new missile force after India conflict, PM says

Standing on White House roof, Trump jokes about installing missiles

Israel intercepts Huthi missiles ans strikes Hezbollah missile factory killing 4

CHIP TECH
Leonardo DRS completes first sea trials of maritime counter drone system for small uncrewed vessels

Poland accuses Russia over military drone blast

Royal Canadian Navy selects MDA Space for next generation drone surveillance systems

Lithuania requests NATO help after Russian drone incident

CHIP TECH
Globalstar strengthens defense reach with resilient satellite and 5G solutions

Space Force taps five firms to develop secure global tactical satcom solutions

SES Secures 5 Year Army Contract for Global Tactical Satellite Communications

SES and Luxembourg to expand military satcom with next generation GovSat2

CHIP TECH
China to showcase latest military hardware at September parade

US soldier tried to give tank details to Russia: Justice Dept

US 'moving at haste' to get Ukraine weapons: envoy

Finnish MPs approve withdrawal from anti-mine treaty

CHIP TECH
Council of Europe cautions on weapon sales to Israel

Canada's PM announces billions in defense spending to hit NATO target

Turkey, Senegal discuss defence industry, security cooperation

Germany suspends arms exports to Israel for use in Gaza

CHIP TECH
NATO flies jets over Romania-Ukraine border during Russian attack

China, India pledge to resume flights as Beijing's top diplomat wraps up visit

Russia says must be part of Ukraine security guarantees talks

Indian PM to visit China, security chief says

CHIP TECH
Subscribe Free To Our Daily Newsletters




The content herein, unless otherwise known to be public domain, are Copyright 1995-2026 - Space Media Network. All websites are published in Australia and are solely subject to Australian law and governed by Fair Use principals for news reporting and research purposes. AFP, UPI and IANS news wire stories are copyright Agence France-Presse, United Press International and Indo-Asia News Service. ESA news reports are copyright European Space Agency. All NASA sourced material is public domain. Additional copyrights may apply in whole or part to other bona fide parties. All articles labeled "by Staff Writers" include reports supplied to Space Media Network by industry news wires, PR agencies, corporate press officers and the like. Such articles are individually curated and edited by Space Media Network staff on the basis of the report's information value to our industry and professional readership. Advertising does not imply endorsement, agreement or approval of any opinions, statements or information provided by Space Media Network on any Web page published or hosted by Space Media Network. General Data Protection Regulation (GDPR) Statement Our advertisers use various cookies and the like to deliver the best ad banner available at one time. All network advertising suppliers have GDPR policies (Legitimate Interest) that conform with EU regulations for data collection. By using our websites you consent to cookie based advertising. If you do not agree with this then you must stop using the websites from May 25, 2018. Privacy Statement. Additional information can be found here at About Us.