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Lockheed Martin and Altera complete key electronic warfare demonstration for DoD
A Group 2 Unmanned Air Vehicle flies over the U.S. Army's Yuma Proving Ground to conduct the SHIP-enabled Wideband Transceiver Integrated Flight Test (SWIFT) demonstration.
Lockheed Martin and Altera complete key electronic warfare demonstration for DoD
by Clarence Oxford
Los Angeles CA (SPX) Oct 21, 2024

In a significant collaboration with the Office of the Under Secretary of Defense for Research and Engineering (OUSD-R&E), Lockheed Martin (NYSE: LMT) and Altera, an Intel company, successfully completed the SWIFT (SHIP-enabled Wideband Transceiver Integrated Flight Test) demonstration. This initiative showcased the next generation of electronic warfare capabilities, relying on the integration of Lockheed Martin's 12th Generation Electronic Warfare (Gen12) transceiver with Altera's Agilex 9 Direct RF FPGA.

The SWIFT project, conducted in less than 12 months, involved deploying Altera's FPGA on a Group 2 Unmanned Air Vehicle (UAV) at the U.S. Army's Yuma Proving Ground. The demonstration marked the first time the Direct RF FPGA was tested in a government-run flight environment, successfully proving the Gen12 transceiver's ability to detect, identify, and locate enemy emitters in real-world scenarios.

This demonstration illustrated the potential of small, lightweight, and power-efficient (SWaP) airborne platforms to deliver advanced electronic warfare effects. Lockheed Martin and Altera successfully showcased the versatility of the system, which allows for future capability enhancements. The technology supports both Electronic Support (ES) and Electronic Attack (EA) missions using a SOSA-aligned digital transceiver built on U.S.-manufactured semiconductors.

The demonstration also highlighted the strategic importance of the OUSD-R&E's State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program, which focuses on delivering domestically produced microelectronics designed for Department of Defense (DoD) missions.

Industry Impact and Future Applications
The success of the SWIFT demonstration was further emphasized at a recent event at Lockheed Martin's Global Vision Center in Crystal City, Virginia. Attendees were shown video footage of the flight test, underlining the swift integration of Altera's MCP-2 chip into the UAV. The event featured key discussions from DoD leadership, Lockheed Martin executives, and Altera representatives on the future of electronic warfare technologies and the importance of the SHIP program.

"The SHIP program's transformative influence on DoD capabilities bolsters confidence in these ongoing advancements and paves the way for their integration throughout the military," commented Dr. Steven Walker, vice president and chief technology officer at Lockheed Martin.

John Sotir, Senior Director of Military Aerospace and Government Business at Altera, added, "Altera's proud to participate in Lockheed Martin's demonstration along with OUSD-R&E SHIP program. Leveraging decades of leadership in chiplet development and manufacturing has led to the rapid readiness and availability of production quality, SWAP-centric MCP-2 products for future mission requirements."

The successful SWIFT demonstration paves the way for further collaboration between Lockheed Martin, Altera, and other industry partners. As the technology progresses, it will be adapted to deliver targeting and situational awareness information for military platforms, with the potential for future DoD programs of record. Lockheed Martin will continue to demonstrate the capabilities of its Gen12 technology, aiming for swift transitions into active military use.

The SHIP program is a Department of Defense initiative focused on advancing the development and delivery of U.S.-made microelectronics for defense applications. It aims to produce secure, trusted devices that reduce the size, weight, and power requirements of military systems.

Under the SHIP program, Altera's MCP-2 chip was developed in collaboration with Lockheed Martin, supported by the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) contract. This partnership enables rapid deployment of new electronic warfare capabilities to support critical warfighter missions.

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