Sivers Semiconductors and Doosan Announce Joint Initiative to Advance Ka-Band SATCOM Antenna Technology

by Robert Schreiber
Berlin, Germany (SPX) Nov 26, 2025
Sivers Semiconductors AB has entered a $1.5 million contract with Doosan Corporation to jointly develop scalable electronically steerable array (ESA) antenna panels for Ka-band satellite communications.

The agreement will support the design and development of ESA systems using Sivers' upcoming Ka-band SATCOM beamforming integrated circuits (BFICs). These advanced BFICs, designed for multi-beam, multi-orbit connectivity, are intended to provide high transmit output power and low noise for energy efficiency. Sivers' BFICs enable simultaneous operation across multiple orbits and maintain uninterrupted connectivity by supporting make-before-break handover for both fixed and mobile SATCOM terminals.

Sivers will contribute its in-house expertise in antenna array design to the creation of the scalable ESA panels. Doosan will oversee manufacturing and system testing, utilizing its high-precision fabrication experience for the ESA panels. The goal of the collaboration is to create systems scaled from lower-power, compact terminals to large, high-performance gateways, addressing demand for flexible, high-throughput satellite communications.

Vickram Vathulya, CEO of Sivers Semiconductors, stated, "Our strategic collaboration with Doosan marks an important milestone for Sivers as we expand our footprint in the global SATCOM market. Our Ka-band BFICs deliver industry-leading efficiency and performance, enabling multi-beam, multi-orbit connectivity that is essential for future SATCOM systems. With the addition of Doosan's advanced manufacturing and system integration capabilities, our technology can achieve new levels of scalability and reliability in ESA architectures."

Harish Krishnaswamy, Managing Director of the Wireless Business Unit at Sivers Semiconductors, added, "Partnering with Doosan allows us to accelerate the development of scalable, energy-efficient SATCOM platforms built on Sivers' proven beamforming technology. Doosan's strong engineering and manufacturing capabilities make them an ideal partner as we work together to deliver high-performance antenna solutions for the next generation of satellite communications."

This collaboration is part of a broader initiative by Sivers and Doosan to support Korea's emerging satellite communications infrastructure and expand advanced antenna systems internationally.